Reflow oven

NURDspace Project
Participants
Skills
Status
Niche
Purpose
Tool
Location
Cost
Tool category

{{{Name}}}Property "Tool Name" (as page type) with input value "{{{Name}}}" contains invalid characters or is incomplete and therefore can cause unexpected results during a query or annotation process. Property "Tool Image" (as page type) with input value "File:{{{Picture}}}" contains invalid characters or is incomplete and therefore can cause unexpected results during a query or annotation process. {{{Picture}}} {{#if:{{{Tool}}} | [[Tool Owner::{{{ProjectParticipants}}} | }} {{#if:{{{Tool}}} | [[Tool Cost::{{{Cost}}} | }}

Description

In order to assemble our own SMD boards, we need something to solder SMD. What is commonly used is a technique called reflowing. With reflowing, solder paste is applied to the to be soldered pads, the devices are mounted and the board is placed inside an oven.

The general idea is to heat the board up to a point where the solder paste liquifies, and forms a metallurgical bond between the pads and the pins of the devices. When the oven reaches 250 degrees, the oven shuts off and the solder becomes solid again, fixating the devices to the board.

The reflow process goes through a heating profile that consists of 4 stages.

1. Pre-heat until 150 deg/c. The oven warms up
2. Soak until 200 deg/c. The heat is allowed time to soak into the board and the devices.
3. Reflow until 250 deg/c. In this stage the solder melts and does what it needs to do to make a bond.
4. Cooldown. At 250 deg/c the reflow process stops and the board is allowed to cool down. At a certain point the solder becomes solid and the process is complete.

Parts:

• Tiny oven
• K-type thermocouple
• Arduino UNO
• Reflow controller shield
• Header pins
• Solid State Relais (SSR)

TODO:

• Order parts
• Assemble SSR
• Solder headers to reflow shield
• Assemble controller
• Test. Works!
• Design case for controller
• Print case
• Create manual
• Design proper probe
• Build proper probe